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半導(dǎo)體分立器件試驗(yàn)-AEC-Q101認(rèn)證

AEC-Q101對(duì)對(duì)各類半導(dǎo)體分立器件的車用可靠性要求進(jìn)行了梳理。AEC-Q101試驗(yàn)不僅是對(duì)元器件可靠性的國際通用報(bào)告,更是打開車載供應(yīng)鏈的敲門磚。百檢檢測(cè)在SiC第三代半導(dǎo)體器件的AEC-Q認(rèn)證上
  •        AEC-Q101對(duì)對(duì)各類半導(dǎo)體分立器件的車用可靠性要求進(jìn)行了梳理。AEC-Q101試驗(yàn)不僅是對(duì)元器件可靠性的國際通用報(bào)告,更是打開車載供應(yīng)鏈的敲門磚。 百檢檢測(cè)在SiC第三代半導(dǎo)體器件的AEC-Q認(rèn)證上具有豐富的實(shí)戰(zhàn)經(jīng)驗(yàn),為您提供專業(yè)可靠的AEC-Q101認(rèn)證服務(wù),同時(shí),我們也開展了間歇工作壽命(IOL)、HAST、H3TRB、HTRB、HTGB、高壓蒸煮(Autoclave)試驗(yàn)服務(wù),設(shè)備能力完全覆蓋以SiC為第三代半導(dǎo)體器件的可靠性試驗(yàn)?zāi)芰Α?/span>

     

    服務(wù)介紹

           隨著技術(shù)的進(jìn)步,各類半導(dǎo)體功率器件開始由實(shí)驗(yàn)室階段走向商業(yè)應(yīng)用,尤其以SiC為代表的第三代半導(dǎo)體器件國產(chǎn)化的腳步加快。但車用分立器件市場(chǎng)均被國外巨頭所把控,國產(chǎn)器件很難分一杯羹,主要的原因之一即是可靠性得不到認(rèn)可。

     

    測(cè)試周期:

           2-3個(gè)月,提供全面的認(rèn)證計(jì)劃、測(cè)試等服務(wù)

     

    產(chǎn)品范圍:

           二、三極管、晶體管、MOS、IBGT、TVS管、Zener、閘流管等半導(dǎo)體分立器件

     

    測(cè)試項(xiàng)目:

    序號(hào)測(cè)試項(xiàng)目縮寫樣品數(shù)/批批數(shù)測(cè)試方法
    1Pre- and Post-Stress Electrical and Photometric TestTEST所有應(yīng)力試驗(yàn)前后均進(jìn)行測(cè)試用戶規(guī)范或供應(yīng)商的標(biāo)準(zhǔn)規(guī)范
    2Pre-conditioningPCSMD產(chǎn)品在7、8、9和10試驗(yàn)前預(yù)處理JESD22-A113
    3External VisualEV每項(xiàng)試驗(yàn)前后均進(jìn)行測(cè)試JESD22-B101
    4Parametric VerificationPV253 Note A用戶規(guī)范
    5High Temperature
    Reverse Bias
    HTRB773 Note BMIL-STD-750-1
    M1038 Method A
    5aAC blocking
    voltage
    ACBV773 Note BMIL-STD-750-1
    M1040 Test Condition A
    5bHigh Temperature
    Forward Bias
    HTFB773 Note BJESD22
    A-108
    5cSteady State
    Operational
    SSOP773 Note BMIL-STD-750-1
    M1038 Condition B(Zeners)
    6High Temperature
    Gate Bias
    HTGB773 Note BJESD22
    A-108
    7Temperature
    Cycling
    TC773 Note BJESD22
    A-104
    Appendix 6
    7aTemperature
    Cycling Hot Test
    TCHT773 Note BJESD22
    A-104
    Appendix 6
    7a
    alt
    TC Delamination
    Test
    TCDT773 Note BJESD22
    A-104
    Appendix 6
    J-STD-035
    7bWire Bond IntegrityWBI53 Note BMIL-STD-750
    Method 2037
    8Unbiased Highly
    Accelerated Stress
    Test
    UHAST773 Note BJESD22
    A-118
    8
    alt
    AutoclaveAC773 Note BJESD22
    A-102
    9Highly Accelerated
    Stress Test
    HAST773 Note BJESD22
    A-110
    9
    alt
    High Humidity
    High Temp.
    Reverse Bias
    H3TRB773 Note BJESD22
    A-101
    10Intermittent
    Operational Life
    IOL773 Note BMIL-STD-750
    Method 1037
    10
    alt
    Power and
    Temperature Cycle
    PTC773 Note BJESD22
    A-105
    11ESD
    Characterization
    ESD30 HBM1AEC-Q101-001
    30 CDM1AEC-Q101-005
    12Destructive
    Physical Analysis
    DPA21 NoteBAEC-Q101-004
    Section 4
    13Physical
    Dimension
    PD301JESD22
    B-100
    14Terminal StrengthTS301MIL-STD-750
    Method 2036
    15Resistance to
    Solvents
    RTS301JESD22
    B-107
    16Constant AccelerationCA301MIL-STD-750
    Method 2006
    17Vibration Variable
    Frequency
    VVF項(xiàng)目16至19是密封包裝的順序測(cè)試。 (請(qǐng)參閱圖例頁面上的注釋H.)JEDEC
    JESD22-B103
    18Mechanical
    Shock
    MS

    JEDEC
    JESD22-B104
    19HermeticityHER

    JESD22-A109
    20Resistance to
    Solder Heat
    RSH301JESD22
    A-111 (SMD)
    B-106 (PTH)
    21SolderabilitySD101 Note BJ-STD-002
    JESD22B102
    22Thermal
    Resistance
    TR101JESD24-3,24-4,26-6視情況而定
    23Wire Bond
    Strength
    WBS最少5個(gè)器件的10條焊線1MIL-STD-750
    Method 2037
    24Bond ShearBS最少5個(gè)器件的10條焊線1AEC-Q101-003
    25Die ShearDS51MIL-STD-750
    Method 2017
    26Unclamped
    Inductive
    Switching
    UIS51AEC-Q101-004
    Section 2
    27Dielectric IntegrityDI51AEC-Q101-004
    Section 3
    28Short Circuit
    Reliability
    Characterization
    SCR103 Note BAEC-Q101-006
    29Lead FreeLF

    AEC-Q005


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